#TABBER AND STRINGER FULL#
The iLS-X1 system inspects processed wafers and cells at full line speed (3600 wafers/hour). The system achieves print-on-print capability of ☑2.5μm at 2Cpk.ĭEK International, Weymouth, UK 44/0-1305-760760. Multiple printheads function independently in parallel to virtually eliminate downtime.
Spacer process modules with conveyors can be deployed at initial installation, then exchanged for additional print capacity when demand dictates. The Eclipse incorporates a series of field retrofittable process modules–print head and loader are primary “master units,” with additional modules operating as secondary “slaves”–that enable manufacturers to easily scale production up and down, to 1200, 2400 or 3600 wph. A related ingot squaring system (SiS152H) can be combined to slice off the round surfaces of the ingot to provide a square surface for subsequent grinding. An optional stocker/loader enables continuous automatic operation. Opposing grind wheels for both coarse and fine finishing enable simultaneous grinding of two opposing sides or chamfers. Floating head and tail stocks enable automatic centering and secure clamping of the ingot and provide stable attachment for processing. The SiG154H silicon ingot grinder coarses and fine-grinds all four sides and chamfers of a solar silicon ingot (up to 200mm-dia. An upgraded ribbon unwinding and stretching system permits precise placement, avoiding bowing and misalignment. The process is heat-controlled over the soldering station, including the unloading belt, to reduce and prevent thermal stress. The TS Gold series comes in three versions, with throughputs ranging from 300-600 cells/hour.
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